MSc Ahmed Abdelwahab

PhD student
Electronic Components, Technology and Materials (ECTM), Department of Microelectronics

Biography

Ahmed completed his bachelor’s degree in Materials science from the faculty of engineering, Ain shams university in Cairo, Egypt. He earned a master’s degree in Materials science from Darmstadt University of Technology in Germany(2021). During his studies  he worked as a research intern at Merck KGaA Electronics business sector. After successfully completing his internship he was offered the opportunity to work on his master’s thesis in the same department. During this time (February 1st, 2020 to May 31st, 2021), Ahmed worked on several topics, including microelectronics test devices fabrication, lithography, optimization of device designs for reliability tests, and design of alternative protection layers for bond pads of microelectronic test devices (master thesis topic). After graduation, Ahmed worked as a research assistant for a short period at the Max Planck Institute for Polymer Research. Later, he joined the Department of Molecular Physics at Lodz University of Technology as a physicist from October 2021 to April 2022.

In June 2022, Ahmed joined TU Delft as a PhD candidate in the Electronics Components Technology and Materials (ECTM) group in the Department of Microelectronics. He is currently working on a joint project between TUD and ITEC focusing on developing technology for ultra-high throughput and sustainable chip assembly processes, which will contribute to the next generation of chip assembly.

Next-generation chip assembly processes

Developing technology for ultra-high throughput and sustainable chip assembly processes.

  1. Contactless drop-attach adhesive bonding: An experimental study of mounting-pressure effects in microchip assembly
    Ahmed Abdelwahab; Fiona J. Horne; Zohreh Farmani; Henk van Zeijl; Hans Kuipers; Jiajie Fan; GuoQi Zhang;
    Journal of Materials Research and Technology,
    Volume 43, pp. 2810-2824, 2026. DOI: 10.1016/j.jmrt.2026.06.226

  2. Liquid-Assisted Contactless Adhesive Bonding: Experimental validation and 2D Multiphysics simulation
    Ahmed Abdelwahab; Zohreh Farmani; Hans Kuipers; Marcel Tichem; Jiajie Fan; GuoQi Zhang;
    In 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2026. DOI: 10.1109/EuroSimE69483.2026.11511664

  3. A method for mounting an electronics component at a particular placement location on a carrier as well as a pick-and-place apparatus for mounting an electronics component at a particular placement location on a carrier
    Stokkermans, Joep; Kuipers, Johannes Josinus; Wesselingh, Jasper; Poelma, Regnerus Hermannus; Bekooij, Bastiaan; Abdelwahab, Ahmed; Van Hoorn, Remco; Mastrangeli, Massimo;
    Patent, WO202601721, 2026.

  4. Pick-and-Release: a Novel Contactless Bonding Method for Die Attachment
    A. Abdelwahab; H. van Zeijl; R. van Hoorn; H. Kuipers; M. Mastrangeli;
    In IEEE 75th Electronic Components and Technology Conference (ECTC),
    2025. DOI: 10.1109/ECTC51687.2025.00363

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Last updated: 24 Feb 2025