Ahmed Abdelwahab

Publications

Contactless drop-attach adhesive bonding: An experimental study of mounting-pressure effects in microchip assembly
Ahmed Abdelwahab; Fiona J. Horne; Zohreh Farmani; Henk van Zeijl; Hans Kuipers; Jiajie Fan; GuoQi Zhang;
Journal of Materials Research and Technology,
Volume 43, pp. 2810-2824, 2026. DOI: 10.1016/j.jmrt.2026.06.226
Liquid-Assisted Contactless Adhesive Bonding: Experimental validation and 2D Multiphysics simulation
Ahmed Abdelwahab; Zohreh Farmani; Hans Kuipers; Marcel Tichem; Jiajie Fan; GuoQi Zhang;
In 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2026. DOI: 10.1109/EuroSimE69483.2026.11511664
A method for mounting an electronics component at a particular placement location on a carrier as well as a pick-and-place apparatus for mounting an electronics component at a particular placement location on a carrier
Stokkermans, Joep; Kuipers, Johannes Josinus; Wesselingh, Jasper; Poelma, Regnerus Hermannus; Bekooij, Bastiaan; Abdelwahab, Ahmed; Van Hoorn, Remco; Mastrangeli, Massimo;
Patent, WO202601721, 2026.
Pick-and-Release: a Novel Contactless Bonding Method for Die Attachment
A. Abdelwahab; H. van Zeijl; R. van Hoorn; H. Kuipers; M. Mastrangeli;
In IEEE 75th Electronic Components and Technology Conference (ECTC),
2025. DOI: 10.1109/ECTC51687.2025.00363