dr. R. Sattari
Project Support
Electronic Circuits and Architectures (ELCA), Department of Microelectronics
Promotor:
Electronic Circuits and Architectures (ELCA), Department of Microelectronics
Promotor:
Expertise: Sensor and IC Design, Packaging Reliability, Electronic Components, Process Integration, IC Fabrication
Biography
Romina Sattari joined the Electronic Components, Technology, and Materials (ECTM) group at TU Delft as a PhD candidate in 2019. She holds a PhD in Microelectronics, with her research focused on multi-domain reliability monitoring of semiconductor packages and modules and the development of integrated sensors for package characterization.
She currently works as an IC Design Support Specialist in the Department of Microelectronics, supporting researchers and students in advanced semiconductor technologies, IC design, and the realization of integrated circuits from design through fabrication and post-fabrication. Her work brings together semiconductor technology, device and circuit design, fabrication, packaging, and reliability.
Publications
- Fabrication and integration of partially-transparent ionic polymer–metal composite actuators into microphysiological systems
A. Tajeddin; A. Velarte; R. Sattari; M. Wiendels; A. Hunt; C. L. Mummery; V. Orlova; J. Zhang; V. Portero; E. Pueyo; A. Otín; M. Mastrangeli;
Sensors and Actuators A: Physical,
Volume 410, pp. 118243, 2026. DOI: 10.1016/j.sna.2026.118243 - Thermo-Mechanical Test Chip with On-Chip Piezoresistive Stress Sensors
Romina Sattari; Ole Bergmann; Henk van Zeijl; Zu Yao Chang; Guo Qi Zhang;
IEEE Sensors Journal,
2026. DOI: 10.1109/JSEN.2026.3684210 - Fabrication and integration of partially-transparent ionic polymer–metal composite actuators into microphysiological systems
A. Tajeddin; A. Velarte; R. Sattari; M. Wiendels; A. Hunt; C. L. Mummery; V. Orlova; J. Zhang; V. Portero; E. Pueyo; A. Otín; M. Mastrangeli;
Sensors and Actuators A: Physical,
Volume 410, Issue P1, pp. 118243, 2026. DOI: 10.1016/j.sna.2026.118243 - Partially-transparent ionic polymer-metal composite actuators for microphysiological systems
A. Tajeddin; A. Velarte Iranzo; R. Sattari; M. Wiendels; A. Hunt; C. L. Mummery; V. Orlova; A. Otin; E. Pueyo; M. Mastrangeli;
In EUROoCS Conference 2026,
2026. - Partially-transparent ionic polymer-metal composite actuators for microphysiological systems
A. Tajeddin; A. Velarte Iranzo; R. Sattari; M. Wiendels; A. Hunt; C. L. Mummery; V. Orlova; A. Otin; E. Pueyo; M. Mastrangeli;
In EUROoCS Conference 2026,
2026. - An In-package EMC based Relative Humidity Sensor
R. Sattari; H. Van Zeijl; Z.Y. Chang; G.Q. Zhang;
IEEE Sensors Journal,
2025. DOI: 10.1109/JSEN.2025.3571230 - Multi-domain reliability monitoring of semiconductor packaging in harsh environments
Romina Sattari;
PhD thesis, Delft University of Technology, 2025. - Multi-domain reliability monitoring of semiconductor packaging in harsh environments
Romina Sattari;
PhD thesis, Delft University of Technology, 2025. - Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
Applied Thermal Engineering,
Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503 - Design, Fabrication, and Characterization of a 4H-SiC CMOS Readout Circuit for Monolithic Integration with SiC Sensors
R. Sattari; H. van Zeijl; G. Zhang,;
24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
pp. 1-3, 2023. DOI: 10.23919/EMPC55870.2023.10418435 - Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials
R. Sattari; H. van Zeijl; G. Zhang;
IEEE 25th Electronics Packaging Technology Conference (EPTC),
pp. 588-591, 2023. DOI: 10.1109/EPTC59621.2023.10457675 - Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
Romina Sattari; Dong Hu; Xu Liu; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
Applied Thermal Engineering,
Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503 - Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
Romina Sattari; Henk van Zeijl; GuoQi Zhang;
In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2023. DOI: 10.1109/EuroSimE56861.2023.10100771 - A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
Romina Sattari; Henk van Zeijl; GuoQi Zhang;
In Proc. of Electronic Components and Technology Conference (ECTC),
2023. - Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
Romina Sattari; Henk van Zeijl; Guoqi Zhang;
In Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
pp. 1-6, 2023. DOI: 10.1109/EuroSimE56861.2023.10100771 - A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
Romina Sattari; Henk van Zeijl; Guoqi Zhang;
In Proceedings of the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
IEEE, pp. 1309-1313, 2023. DOI: 10.1109/ECTC51909.2023.00223 - In-situ reliability monitoring of power packages using a Thermal Test Chip
H. A. Martin; R. Sattari; E. C. P. Smits; H. W. van Zeijl; W. D. van Driel; GuoQi Zhang;
In 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
2022. DOI: 10.1109/EuroSimE54907.2022.9758913 - In-situ reliability monitoring of power packages using a Thermal Test Chip
H.A. Martin; R. Sattari; E.C.P. Smits; H.W. van Zeijl; W.D. van Driel; G.Q. Zhang;
In 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
IEEE, pp. 1-10, 2022. DOI: 10.1109/EuroSimE54907.2022.9758913 - Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
R. Sattari; H. van Zeijl; GuoQi Zhang;
In 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
2021. DOI: 10.23919/EMPC53418.2021.9584984 - Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
Romina Sattari; Henk van Zeijl; GuoQi Zhang;
In 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
IEEE, pp. 1-7, 2021. DOI: 10.23919/EMPC53418.2021.9584984
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Last updated: 25 Aug 2026
