Romina Sattari

1. Fabrication and integration of partially-transparent ionic polymer–metal composite actuators into microphysiological systems
   A. Tajeddin; A. Velarte; R. Sattari; M. Wiendels; A. Hunt; C. L. Mummery; V. Orlova; J. Zhang; V. Portero; E. Pueyo; A. Otín; M. Mastrangeli;
   Sensors and Actuators A: Physical,
   Volume 410, pp. 118243, 2026. DOI: 10.1016/j.sna.2026.118243

2. Thermo-Mechanical Test Chip with On-Chip Piezoresistive Stress Sensors
   Romina Sattari; Ole Bergmann; Henk van Zeijl; Zu Yao Chang; Guo Qi Zhang;
   IEEE Sensors Journal,
   2026. DOI: 10.1109/JSEN.2026.3684210

3. Fabrication and integration of partially-transparent ionic polymer–metal composite actuators into microphysiological systems
   A. Tajeddin; A. Velarte; R. Sattari; M. Wiendels; A. Hunt; C. L. Mummery; V. Orlova; J. Zhang; V. Portero; E. Pueyo; A. Otín; M. Mastrangeli;
   Sensors and Actuators A: Physical,
   Volume 410, Issue P1, pp. 118243, 2026. DOI: 10.1016/j.sna.2026.118243

4. Partially-transparent ionic polymer-metal composite actuators for microphysiological systems
   A. Tajeddin; A. Velarte Iranzo; R. Sattari; M. Wiendels; A. Hunt; C. L. Mummery; V. Orlova; A. Otin; E. Pueyo; M. Mastrangeli;
   In EUROoCS Conference 2026,
   2026.

5. Partially-transparent ionic polymer-metal composite actuators for microphysiological systems
   A. Tajeddin; A. Velarte Iranzo; R. Sattari; M. Wiendels; A. Hunt; C. L. Mummery; V. Orlova; A. Otin; E. Pueyo; M. Mastrangeli;
   In EUROoCS Conference 2026,
   2026.

6. An In-package EMC based Relative Humidity Sensor
   R. Sattari; H. Van Zeijl; Z.Y. Chang; G.Q. Zhang;
   IEEE Sensors Journal,
   2025. DOI: 10.1109/JSEN.2025.3571230

7. Multi-domain reliability monitoring of semiconductor packaging in harsh environments
   Romina Sattari;
   PhD thesis, Delft University of Technology, 2025.

8. Multi-domain reliability monitoring of semiconductor packaging in harsh environments
   Romina Sattari;
   PhD thesis, Delft University of Technology, 2025.

9. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
   R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
   Applied Thermal Engineering,
   Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

10. Design, Fabrication, and Characterization of a 4H-SiC CMOS Readout Circuit for Monolithic Integration with SiC Sensors
    R. Sattari; H. van Zeijl; G. Zhang,;
    24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
    pp. 1-3, 2023. DOI: 10.23919/EMPC55870.2023.10418435

11. Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials
    R. Sattari; H. van Zeijl; G. Zhang;
    IEEE 25th Electronics Packaging Technology Conference (EPTC),
    pp. 588-591, 2023. DOI: 10.1109/EPTC59621.2023.10457675

12. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
    Romina Sattari; Dong Hu; Xu Liu; Henk van Zeijl; Sten Vollebregt; GuoQi Zhang;
    Applied Thermal Engineering,
    Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

13. Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2023. DOI: 10.1109/EuroSimE56861.2023.10100771

14. A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In Proc. of Electronic Components and Technology Conference (ECTC),
    2023.

15. Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
    Romina Sattari; Henk van Zeijl; Guoqi Zhang;
    In Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    pp. 1-6, 2023. DOI: 10.1109/EuroSimE56861.2023.10100771

16. A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
    Romina Sattari; Henk van Zeijl; Guoqi Zhang;
    In Proceedings of the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
    IEEE, pp. 1309-1313, 2023. DOI: 10.1109/ECTC51909.2023.00223

17. In-situ reliability monitoring of power packages using a Thermal Test Chip
    H. A. Martin; R. Sattari; E. C. P. Smits; H. W. van Zeijl; W. D. van Driel; GuoQi Zhang;
    In 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    2022. DOI: 10.1109/EuroSimE54907.2022.9758913

18. In-situ reliability monitoring of power packages using a Thermal Test Chip
    H.A. Martin; R. Sattari; E.C.P. Smits; H.W. van Zeijl; W.D. van Driel; G.Q. Zhang;
    In 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
    IEEE, pp. 1-10, 2022. DOI: 10.1109/EuroSimE54907.2022.9758913

19. Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
    R. Sattari; H. van Zeijl; GuoQi Zhang;
    In 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
    2021. DOI: 10.23919/EMPC53418.2021.9584984

20. Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
    Romina Sattari; Henk van Zeijl; GuoQi Zhang;
    In 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
    IEEE, pp. 1-7, 2021. DOI: 10.23919/EMPC53418.2021.9584984

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