dr.ir. M. van Soestbergen

Expertise: Thermo-mechanical behaviour, moisture-induced degradation, multi-physics simulation, digital twins, model order reduction, and physics-of-failure methodologies

Dr. ir. Michiel van Soestbergen is part-time Assistant Professor within the Electronic Components, Technology and Materials (ECTM) group of the Department of Microelectronics at Delft University of Technology and Senior Principal Engineer at NXP Semiconductors. His research focuses on the reliability of advanced microelectronic packages, with particular emphasis on thermo-mechanical behaviour, moisture-induced degradation, multi-physics simulation, digital twins, model order reduction, and physics-of-failure methodologies.

He received his M.Sc. degree in Mechanical Engineering (2006) and his Ph.D. degree (2011) from Delft University of Technology. Following a postdoctoral appointment within the Faculty of Applied Physics at Eindhoven University of Technology, he joined NXP Semiconductors in 2014. He has coordinated and contributed to several European and nationally funded research initiatives and serves as Program Chair of the International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). He contributes to education through teaching and supervision of MSc and PhD students at TU Delft.

Dr. Van Soestbergen has published extensively in the fields of microelectronics reliability and electronic packaging and is inventor on several patents. His current research interests include digital twins, virtual prototyping, and reliability-driven design methodologies.

Last updated: 24 Aug 2026