MSc thesis project proposal
SiC MEMS for Extreme Environments (Stipend Opportunity) - EI-ECTM Synergy
SiC is a robust semiconductor that has been shown to operate up to 800 °C. Previous work at TU Delft has demonstrated the operation of SiC CMOS circuits in harsh conditions and the initial development of micromachining SiC to enable MEMS devices. This thesis aims to design and realize MEMS devices using SiC-on-Insulator structures to test in harsh environments. Such wafers are recently emerging to push the operation of SiC MEMS devices towards 1000 °C.
The thesis will focus on realizing surface micromachined devices, like accelerometers and gyroscopes, usually fabricated in SOI processes. Possible applications of such devices would be for geothermal drilling or monitoring high-temperature machines like jet engines. The involved research group recently acquired a SiC-on-insulator wafer, and alternatively, a SiC-CNT composite process for high aspect ratio surface micromachining is available.
Assignment
Students should start this thesis in september or earlier to accomodate the upcoming EKL schedules
- A literature review of existing harsh environment MEMS devices in bulk SiC and SiC – oxide – silicon wafers.
- Analytical analysis of SiC MEMS to determine which MEMS to create
- Finite element modelling set up to design MEMS device & optimization of a target MEMS device
- Design of a fabrication flow chart
- Realization of fabrication of a first prototype structure (EKL timing to be determined)
- Preliminary device testing/ analysis of next step system integration
- Thesis Writing
Requirements
We require a Microelectronics EE Master track student, with a Devices profile and courses:
a. Semiconductor device physics (must-have)
b. IC & MEMS technology course (must-have)
c. Measurement & instrumentation (nice to have)
d. Microsystems Modelling (must-have)
e. ET4icp technology processing course (nice to have)
Students from Mechanical Engineering are also encouraged to apply if they have similar courses above.
Reach out to Karen Dowling (EI) or Sten Vollebregt (ECTM) for an interview. A scholarship stipend of 500 Euros/month is available for this project.
Contact
dr. Karen Dowling
Electronic Instrumentation Group
Department of Microelectronics
Last modified: 2025-04-29
